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姓名Name 楊申語 Sen-Yeu Yang
職稱Title 教授 Professor
辦公室Office 703, 704
電話Phone 33662681
傳真Fax 2363-1755
電子郵件E-mail syyang@ntu.edu.tw
個人網頁Homepage  
實驗室Lab 塑膠加工實驗室127
自傳
Short Biography
美國University of Minnesota機械工程博士
研究領域
Research Interests
塑膠加工、金屬成型
Polymer processing, metal forming
教學課程
Teaching Courses
塑膠加工、模具設計、製造原理、工具機、工程與生活
polymer processing, mold design, manufacturing principles, machine tools, engineering with applications
研究計劃
Research Projects

研究計畫 : 過去五年總計畫經費 NT$ 22,660,800

Research Projects: Total fund in the past five years: NT$ 22,660,800

1.微透鏡陣列滾輪式轉印製程之開發,主持人,計畫期間:2006/8/1至2008/7/31,委任單位:行政院國家科學委員會 (95-2221-E-002-045-MY2),研究經費:NT $1,867,000。

2.精密塑膠光學元件模具與複製成型技術整合研究-子計畫一:精密塑膠光學元件複,主持人,計畫期間:2006/8/1至2007/7/31,委任單位:行政院國家科學委員會,$874,000。

3.精密塑膠光學元件模具與複製成型技術整合研究-總計畫,主持人,計畫期間:2006/8/1 至2007/7/31,委任單位:行政院國家科學委員會(95-2221-E-002-212-),研究經費:NT $423,000。

4.奈米壓印系統設備開發及製程研究-子計畫一:流體壓印設備開發研究,主持人,計畫期間:2005/8/1至2006/10/31,委任單位:行政院國家科學委員會(94-2212-E-002-038-),研究經費:NT $1,336,000。

5.奈米壓印系統設備開發及製程研究-總計畫,主持人,計畫期間:2005/8/1至 2006/11/30,委任單位:行政院國家科學委員會(94-2212-E-002-037-),研究經費:NT $1,432,000。

6.塑膠繞射光學元件之精密成型技術整合研究(II)-子計畫一:塑膠繞射光學元件之微透鏡陣列模仁製作及複製成型研究,主持人,計畫期間:2005/8/1至2006/10/31,委任單位:行政院國家科學委員會(94-2212-E-002-036-),研究經費:NT $692,000。

7.塑膠繞射光學元件之精密成型技術整合研究(II)-總計畫,主持人,計畫期間:2005/8/1至2006/10/31,委任單位:行政院國家科學委員會(94-2212-E-002-035-),研究經費:NT $842,000。

8.奈米壓印系統設備開發及製程研究-子計畫一:流體壓印設備開發研究,主持人,計畫期間:2004/8/1至2005/10/31,委任單位:行政院國家科學委員會(93-2218-E-002-017- ),研究經費:NT $544,500。

9.奈米壓印系統設備開發及製程研究-總計畫,主持人,計畫期間:2004/8/1至 2005/10/31,委任單位:行政院國家科學委員會(93-2218-E-002-016- ),研究經費:NT $1,000,000。

10.塑膠繞射光學元件之精密成型技術整合研究-子計畫一:塑膠繞射光學元件之一模多穴射出成型與不等行程射出壓縮成型研究,主持人,計畫期間:2004/8/1至2005/9/30,委任單位:行政院國家科學委員會(93-2218-E-002-020- ),研究經費:NT $ 649,800。

11.塑膠繞射光學元件之精密成型技術整合研究-總計畫,主持人,計畫期間:2004/8/1至 2005/7/31,委任單位:行政院國家科學委員會(93-2218-E-002-019- ),研究經費:NT $ 543,400。

12.光學精密元件射出成形之整合研究(II)-子計畫一:楔型板件精密射出與射出壓縮成形研究(II),主持人,計畫期間:2003/8/1至2004/7/31,委任單位:行政院國家科學委員會(92-2212-E-002-071- ),研究經費:NT $ 494,600。

13.光學精密元件射出成形之整合研究(II)-子計畫一:楔型板件精密射出與射出壓縮成形研究(II),共同主持人,計畫期間:2003/8/1至2004/7/31,委任單位:行政院國家科學委員會(92-2212-E-002-071- ),研究經費:NT $ 494,600

14.總計畫-光學精密元件射出成形之整合研究(Ⅱ),主持人,計畫期間:2003/8/1至2004/9/30,委任單位:行政院國家科學委員會(92-2212-E-002-070- ),研究經費:NT $ 716,100。

15.總計畫-光學精密元件射出成形之整合研究(Ⅱ),共同主持人,計畫期間:2003/8/1至2004/9/30,委任單位:行政院國家科學委員會(92-2212-E-002-070- ),研究經費:NT $716,100。

16.產學合作計畫:創新型微光學增光分色片應用於CMOS影像感測器之研究(2/2),主持人,計畫期間:2003/5/1至2004/7/31,委任單位:行政院國家科學委員會(92-2622-E-002-029- ),研究經費:NT $3,708,000。

17.光學精密元件射出成形之整合研究-子計畫一:楔形板件精密射出與射出壓縮成型研究,主持人,計畫期間:2002/8/1至2003/7/31,委任單位:行政院國家科學委員會(91-2212-E-002-027- ),研究經費:NT $847,900。

18.光學精密元件射出成形之整合研究-總計畫,主持人,計畫期間:2002/8/1 至 2003/7/31,委任單位:行政院國家科學委員會(91-2212-E-002-028- ),研究經費:NT $347,700。

19.產學合作計畫:創新型微光學增光分色片應用於CMOS影像感測器之研究(1/2),主持人,計畫期間:2002/5/1至2003/7/31,委任單位:行政院國家科學委員會(91-2622-E-002-004- ),研究經費:NT $5,514,800。

研究著作
publications

A.期刊論文

  1. Tzu-Chien Huang, Jing-Tang Wu, Sen-Yeu Yang, Po-Hsun Huang, Shuo-Hung Chang, “Direct fabrication of microstructures on metal roller using stepped rotating lithography and electroless nickel plating” Microelectronic Engineering, 86, 615-618 (2009) (SCI)
  2. Bin-Da Chan, Kuo-Huang Hsieh, and Sen-Yeu Yang, ”Thin film patterns directly fabricated using transfer stamping technique”, Journal of Micromechanics and Microengineering, 19 (2009) 025010 (8pp) (SCI)
  3. Tzu-Chien Huang, Bin-Da Chan , Jyun-Kai Ciou, Sen-Yeu Yang, “Fabrication of Microlens Arrays Using CO2-Assisted Embossing Technique”, Journal of Micromechanics and Microengineering, 19, (2009) 015018 (SCI)
  4. Bin-Da Chan1, Kuo-Huang Hsieh2, and Sen-Yeu Yang1* ,“Fabrication of organic flexible electrodes using transfer stamping process, MICROELECTRONIC ENGINEERING, 86, 586-589 ,2009. (SCI)
  5. Po-Hsun Huang, Tzu-Chien Huang, and Sen-Yeu Yang, “Bubble-free large-area replication of microstructures using gas-assisted UV embossing with modified reversal imprinting and gap-retained vacuuming” Journal of Vacuum Science and Technology B, 2008 (SCI, EI, revision under review)
  6. Sen-Yeu Yang* Tzu-Chien Huang, Po-Hsun Huang, and Tai-Yu Ko, “Improving Flow Balance during Filling a Multi-Cavity Mold with Modified Runner Systems” International Polymer Processing, 2008, vol. XXIII, n° 4. - 363-369 (7 pages) (SCI)
  7. Y. J. Weng*, Y.C. Weng, and S. Y. Yang, “The Development and Research for Applying Innovative Magnetic Soft Mold Imprinting Techniques in Microstructure Component Manufacturing” Polymers for Advanced Technologies, 2008, v 19, n 9, p 1177-1184 [SCI, EI, Times cited: 0] [SCI IF=1.406]
  8. Y. J. Weng*, Y.C. Weng, and S. Y. Yang, “Study on the formation defect of nano imprinted optical waveguide devices and nano-indentation detection” Polymers for Advanced Technologies, 2008, Volume 19, Issue 12, 1704-1709 [SCI IF=1.406
  9. Fang-Sung Cheng, Pei-Ying Huang, and Sen-Yeu Yang*, “Polymer-ridge waveguide fabrication by gas-assisted UV embossing with soft mold” International Polymer Processing, 3, 312-316 (2008). [SCI IF=0.563]
  10. Po-Hsun Huang, Tzu-Chien Huang, Yi-Ting Sun, and Sen-Yeu Yang*, “Fabrication of large area resin microlens arrays using gas-assisted ultraviolet embossing” Optics Express, 16, No. 5, 3041-3048 (2008). [SCI, EI, Times cited: 0] [SCI IF= 4.009]
  11. Tzu-Chien Huang, , Jian-Ren Ciou, Po-Hsun Huang, Kuo-Huang Hsieh, and Sen-Yeu Yang*, “Fast fabrication of integrated surface-relief and particle-diffusing plastic diffuser by use of a hybrid extrusion roller embossing process” Optics Express, 16, No.1, 470-477 (2008). [SCI, EI, Times cited: 0] [SCI IF= 4.009]
  12. Sen-Yeu Yang*, Tzu-Chien Huang, Jyun-Kai Ciou, Bin-Da Chan, Chih-Yuan Chang, and John G. Loeser, “CO2-Assisted Embossing for fabrication of PMMA component under low temperature and with low pressure,” Journal of Micromechanics and Microengineering, 18, No. 2, 501-507 (2008). [SCI, EI, Times cited: 0] [SCI IF= 2.321]
  13. Fang-Sung Cheng, Sen-Yeu Yang*, and Chien-Chang Chen, “Novel hydrostatic pressuring mechanism for soft UV-inprinting processes” Journal of Vacuum Science and Technology B, 26, 132-136 (2008). [SCI, EI, Times cited: 0] [SCI IF= 1.597]
  14. Sen-Yeu Yang*, Tzu-Chien Huang, Po-Hsun Huang, Tai-Yu Ko,” Study on flow imbalance during filling a multi-cavity mold using a H-type runners”, Key Engineering Materials, 364-366, 1306-1311 (2008). [EI, Times cited: 0]
  15. Liang-Ting Jiang, Tzu-Chien Huang, Chien-Ren Ciou, Chih-Yuan Chang, Sen-Yeu Yang*, and Po-Hsun Huang, “Direct fabrication of rigid microstructures on a metallic roller using a dry film resist” Journal of Micomechanics and Microengineering, 18, No. 1, 501-506 (2008). [SCI, EI, Times cited: 0] [SCI IF= 2.321]
  16. Sen-Yeu Yang*, Fang-Sung Cheng, Sue-Wen Xu, Po-Hsun Huang, and Tzu-Chien Huang, “Fabrication of Microlens Arrays Using UV Micro-Stamping with Soft Roller and Gas-pressurized Platform” Microelectronic Engineering, 85, 603-609 (2008). [SCI, EI, Times cited: 0] [SCI IF= 1.398]
  17. Y. J. Weng*, Sen-Yeu Yang, Y.C. Weng and L.A. Wang, “Fabrication of buried waveguide microstructure using gas-assisted micro/nanoimprinting with soft mold” Polymers for Advanced Technologies, 18, 993-998 (2007). [SCI, EI, Times cited: 0] [SCI IF=1.406]
  18. Y. J. Weng*, Y.C. Weng, S.Y. Yang, and L.A. Wang, “Fabrication of optical waveguide devices using gas-assisted UV micro/nanoimprinting with soft mold” Polymers for Advanced Technologies, 18, 876-882 (2007). [SCI, EI, Times cited: 0] [SCI IF=1.406]
  19. Liang-Ting Jiang, Tzu-Chien Huang, Chien-Ren Ciou, Chih-Yuan Chang, and Sen-Yeu Yang*, “Fabrication of plastic microlens arraya using hybrid extrusion rolling embossing with a metallic cylinder mold fabricated using dry film resist” Optics Express, 15, 12088-12094 (2007). [SCI, EI, Times cited: 0] [SCI IF=4.009]
  20. Y. J. Weng, S. Y. Yang*, M.S. Wu, Y.C. Weng and L.A. Wang, “A study on the innovative microlens projection lithography applied to the production of microstructures” Polymers for Advanced Technologies, 18, 841-844 (2007). [SCI, EI, Times cited: 0] [SCI IF=1.406]
  21. Chih-Yuan Chang, Sen-Yeu Yang, Meng-Shen Wu, Liang-Ting Jiang and Lon A. Wang, “A novel method for fabrication of plastic microlens array with aperture stops for projection photolithography”, Japanese Journal of Applied Physics, 46, 2932-2935 (2007). [SCI, EI, Times cited: 0] [SCI IF=1.222]
  22. Chih-Yuan Chang, Sen-Yeu Yang*, Ming-Hui Chu, “Rapid fabrication of ultraviolet-cured polymer microlens arrays by soft roller stamping process” Microelectronic Engineering, 84 355–361 (2007). [SCI, EI, Times cited: 0] [SCI IF=1.398]
  23. Chih-Yuan Chang, Sen-Yeu Yang*, Long-Sun Huang and Kuo-Huang Hsieh “Fabrication of polymer microlens arrays using capillary forming with a soft mold of micro-holes array and UV-curable polymer,” Optics Express, 14, 6253-6258 (2006). [SCI, EI, Times cited: 5] [SCI IF= 4.009]
  24. Fang-Sung Cheng, S. Y. Yang*, Shih-Chih Nian and Lon A. Wang, “Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate”, J. Vac. Sci. Technol. B, 24, 1724-1727 (2006). [SCI, EI, Times cited: 0] [SCI IF= 1.597]
  25. Chih-Yuan Chang*, Sen-Yeu Yang, Long-Sun Huang and Tian-Ming Jeng, “A novel method for rapid fabrication of microlens array using micro-transfer molding with soft mold,” Journal of Micromechanics and Microengineering, 16, 999-1005 (2006). [SCI, EI, Times cited: 3] [SCI IF= 2.321]
  26. S. Y. Yang, C. K. Huang*, B. C. Lin and W. C. J. Wei, “Kneading and molding of ceramic microparts by precision powder injection molding”, J. of Applied Polymer Science, 100, 892-899 (2006). [SCI, EI, Times cited: 0] [SCI IF= 1.306]
  27. C. Y. Chang, S. Y. Yang*, and J. L. Shje, “A roller embossing process for rapid fabrication of microlens arrays on glass substrates,” Microsystem Technologies, 12, 754-759 (2006). [SCI, EI, Times cited: 6] [SCI IF= 0.673]
  28. C. Y. Chang, S. Y. Yang*, L. S. Huang and J. H. Chang, “Fabrication of plastic microlens array using gas-assisted micro hot-embossing with a silicon mold,” Infrared Physics and Technology, 48, 163-173 (2006). [SCI, EI, Times cited: 3] [SCI IF= 0.970]
  29. S. C. Nian and S. Y. Yang, “Molding of Thin Sheets Using Impact Micro-injection Molding”, International Polymer Processing, Vol. 4, pp.441-448 (2005). [SCI, Times cited: 0] [SCI IF=0.563]
  30. J. H. Chang, F. S. Cheng, C. C. Chao, Y. C. Weng, S. Y. Yang*, and L. A. Wang, “Direct imprinting using soft mold and gas pressure for large area and curved surfaces”, J. Vac. Sci. Technol. A, Vol. 23, No. 6, Nov/Dec, pp.1687-1690 (2005). [SCI, EI, Times cited: 1] [SCI IF=1.394]
  31. C. K. Huang, S. Y. Yang, and C. C. Chen, “Influence of processing on warpage of composite parts”, Journal of Advanced Materials, Vol. 37, No. 4, pp.17-22 (2005). [SCI, EI, Times cited: 1] [SCI IF=0.195]
  32. J. H. Chang and S. Y. Yang*, “Development of Fluid-Based Heating and Pressing Systems for Micro Hot Embossing”, Microsystem Technologies, Vol.11, pp.396-403 (2005). [SCI, EI, Times cited: 3] [SCI IF=0.673]
  33. S. C. Nian and S. Y. Yang*, “Flow Visualization of filling with aid of colored billets during Impact Micro-Injection Molding”, International Polymer Processing, Vol. XIX, No. 4, pp.402-407 (2004). [SCI, Times cited: 1] [SCI IF= 0.563]
  34. Y. K. Shen*, W. Y. Wu, S. Y. Yang, H. M. Jian and C.C. Chen “Study on numerical simulation and experiment of lightguide plate in injection molding”, Journal of Reinforced Plastics and Composites, Vol. 23, No. 11, pp. 1187-1206 (2004). [SCI, EI, Times cited: 0] [SCI IF= 0.427]
  35. S. Y. Yang, C. K. Huang and C. C. Chen, Materials and Manufacturing Processes, Vol. 18, No. 5, pp. 769-781 (2003). [SCI, EI, Times cited: 0]
  36. S. Y. Yang*, C. T. Lin and J. H. Chang, “Secondary Gas Penetrations in Ribs During Full-Shot Gas-Assisted Injection Molding”, Advances in Polymer Technology, Vol. 22, No. 3, pp. 225-237 (2003). [SCI, EI, Times cited: 3]
  37. J. H. Chang and S. Y. Yang*, “Gas Pressurized Hot Embossing for Transcription of Micro-features”, Microsystem Technologies, Vol. 10, No. 1, pp76-80 (2003). [SCI, EI, Times cited: 8]
  38. S. Y. Yang, S. C. Nian and I. C. Sun, International Polymer Processing, Vol. XVII, No. 4, pp.354-360 (2002). [SCI, NSC 91-2622-E-002-004 ] [Times cited: 1]
  39. S. H. Parng and S. Y. Yang*, “Fracture types and thickness distribution in superplastic sheets formed with plastic injection molding”, Journal of Materials Processing Technology, Vol. 120, No. 1-3, pp.133-139 (2002). [SCI, EI, Times cited: 0]
  40. S. Y. Yang*, C. Y. Chen, and S. H. Parng, " Effects of conductive fibers and processing conditions on the electromagnetic shielding effectiveness of injection molded composites", Polymer Composites, Vol. 23, No. 6, pp. 1003-1013 (2002). [SCI, EI, NSC 88-2622-E-002-004] [Times cited: 1]
  41. S. Y. Yang* and H. L. Chou, “Study on the Residual Wall Thickness at Dimensional Transitions and Curved Sections in Gas-Assisted Injection Molded Circular Tubes”, Polymer Engineering and Science, Vol. 42, No. 1, pp.111-119 (2002). [SCI, EI, NSC 90-2216-E-002-020] [Times cited: 7]
  42. S. H. Parng and S. Y. Yang*, “Fracture types and thickness distribution in superplastic sheets formed with plastic injection molding”, Materials and Manufacturing Process, Vol. 10, No. 4, pp.503-518 (2001). [SCI, EI, Times cited: 0]
  43. S. Y. Yang and S. H. Parng, “Injection molding of plastic plates combined with boss features on superplastic Zn-22Al sheet”, International Polymer Processing, Vol. XVII, No. 4, pp.412-420 (2001). [SCI, NSC 89-2622-E-002-011] [Times cited: 0]
  44. S. Y. Yang and S. H. Parng, “Injection Molding of Ribbed Plastic Plates with a Superplastic Zn-22% Al Sheet”, Advances in Polymer Technology, Vol. 20, No. 3,pp.216-225 (2001). [SCI, EI, NSC 88-2622-E-002-004] [Times cited: 1]
  45. W. Y. Wang, W. J. Wei and S. Y. Yang , “Low Pressure Injection Molding Process of Piezoelectric Pb(Zr, Ti)O3 Ceramics ”, Bulletin of the College of Engineering, N.T.U., 79 , June, pp.11-19 (2000).
  46. S. Y. Yang S. C. Jiang, and W. S. Lu, " Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep during PBGA Encapsulation", IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 4, pp.700-706 (2000). [SCI, EI, Times cited: 2]
  47. S. Y. Yang and P. T. Chu, “Void shape in Gas-channel Ribs in Gas-Assisted Injection Molded Plates”, Advances in Polymer Technology, Vol. 18, No. 1, pp.11-17 (1999). [SCI, EI, Times cited: 6]
  48. S. Y. Yang and Y. C. Chen, “Experimental Study of Injection-Charged Compression Molding of Thermoplastics”, Advances in Polymer Technology, Vol. 17, No. 4, pp.353-360 (1998). [SCI, EI, Times cited: 0]
  49. S. H. Parng and S. Y. Yang, “Gas Penetrations in Symmetrical Tapering Ribs during Gas-Assisted Injection Molding”, International Polymer Processing, Vol. 13, No. 3, pp.318-320 (1998). [SCI, Times cited: 8]
  50. C. K. Huang and S. Y. Yang, “Warping in advanced composite tools with varying angles and radii”, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, Vol. 28, No. (9-10) , pp.891-893 (1997) . [SCI, EI, Times cited: 16] [SCI IF=1.875]
  51. C. K. Huang and S. Y. Yang, “Experimental study on the accuracy of advanced composite tools for slanted shapes”, POLYMER COMPOSITES, Vol. 18, No. 4, pp. 442-452 (1997) . [SCI, EI, Times cited: 1]
  52. S. Y. Yang and C. K. Huang, “Curvature predictions of flat advanced composite tools based on measured volume fraction gradient”, Journal of Advanced Materials, Vol. 28, No. 2, pp. 47-55 (1997) . [SCI, EI, Times cited: 0]
  53. C. K. Huang and S. Y. Yang, “Study on accuracy of angled advanced composite tools”, Materials and Manufacturing Processes, Vol. 12, No. 3, pp. 473-486 (1997). [SCI, EI, Times cited: 4]
  54. S. Y. Yang, S.J. Liou, W.N. Liou, “Flow visualization of the gas-assisted injection molding process”, Advances in Polymer Technology, Vol. 16, No. 3, pp.175-183 (1997). [SCI, EI, Times cited: 18] [SCI IF=0.698]
  55. S.Y. Yang, F.Z. Huang, W.N. Liau, “A study of rib geometry for gas-assisted injection molding”, Polymer Engineering and Science, Vol. 36, No. 23, pp.2824-2831 (1996). [SCI, EI, Times cited: 16] [SCI IF=0.698]
  56. S. Y. Yang, C. K. Huang and C. B. Wu, “Influence of processing on quality of advanced composite tools”, Journal of Advanced Materials, Vol. 27, No. 3, pp.37-44 (1996). [SCI, EI, Times cited: 2]
  57. S. Y. Yang and L. Lien, “Effects of cooling time and mold temperature on quality of moldings with precision contour”, Advances in Polymer Technology, Vol. 15, No. 4, p 289-295 (1996). [SCI, EI, Times cited: 4]
  58. S. Y. Yang and L. Lien, “Experimented Study on the Injection Compression Molding of Parts with Precision Contours”, R.C. Intentional Polymer Processing, V11(2), pp. 188-190(1996)
  59. S. Y. Yang and L. Nien, “Experimental study on injection compression molding of cylindrical parts”, Advances in Polymer Technology, Vol. 15, No. 3, pp.205-213 (1996). [SCI, EI, Times cited: 2]
  60. S. Y. Yang and M. Z. Ke, “Experimental study on the effects of adding compression to injection molding process”, Advances in Polymer Technology, Vol.14, No. 1 , pp.15-24 (1995). [SCI, EI, Times cited: 10] [SCI IF=0.698]
  61. S. Y. Yang and S. J. Liou, “Development of moldability diagrams for gas-assisted injection molding”, Advances in Polymer Technology, Vol. 14, No. 3, pp.197-205 (1995). [SCI, EI, Times cited: 10] [SCI IF=0.698]
  62. S. Y. Yang and M. Z. Ke, “Influence of processing on quality of injection-compression-molded disks”, Polymer Engineering and Science, Vol. 35, No. 15, p 1206-1212 (1995). [SCI, EI, Times cited: 5]
  63. S. Y. Yang and F. Z. Huang, “Unstable gas penetrations in symmetrical rib channels during gas-assisted injection molding”, International Polymer Processing, Vol. 10, No. 2, pp.186-187 (1995). [SCI, Times cited: 8]
  64. S. Y. Yang and H. C. Chang, “Study on the performance of cooling systems in precision injection molds”, International Polymer Processing, Vol. 10, No. 3, pp.255-261 (1995). [SCI, Times cited: 1]

 B.研討會論文

  • Bin-Da Chan, Kuo-Huang Hsieh, Sen-Yeu Yang, “Development of Transfer Stamping Process to Fabricate Flexible Organic Electrodes” The 2008 International Symposium on Flexible Electronics and Displays (ISFED), 13-14 November 2008, Hsinchu, Taiwan
  • Tzu-Chien Huang, Sen-Yeu Yang, Po-Hsun Huang, Shuo-Hung Chang “Direct fabrication of microstructures on metal roller using stepped rotating lithography and electroless nickel plating” The 34th International Conference on Macro and Nano Engineering, 15 -18 September 2008 Athens, Greece.
  • Bin-Da Chan , Kuo-Huang Hsieh, Sen-Yeu Yang, “Fabrication of organic flexible electrodes using transfer stamping process” The 34th International Conference on Macro and Nano Engineering, 15 -18 September 2008 Athens, Greece.
  • Y.-J. Weng and S.-Y. Yang “A Study on the Application of Innovative Magnetically Assisted Flexible Magnetic Mold in Large-Area Curved Surface Microstructure Impressing Process Technology”, The 42nd IUPAC World Polymer Congress(MACRO2008), June 29 -July 4 ,2008, Taipei,Taiwan.
  • Y.-J. Weng,Y.-C. Weng and S.-Y. Yang “Development and Research for Applying Creative Magnetic Soft Mold Imprinting Techniques in Microstructure Manufacturing”, The 42nd IUPAC World Polymer Congress(MACRO2008), June 29 - July 4, 2008, Taipei,Taiwan.
  • Sen-Yeu Yang*, Tzu-Chien Huang, Yen-Hao Chen, Po-Hsun Huang, and Ying-Ta Chu “The effects of processing parameters on the oxidation of Be-Cu alloy mold inserts in injection molding”, The 42nd IUPAC World Polymer Congress(MACRO2008), June 29 - July 4, 2008, Taipei,Taiwan.
  • S. Y. Yang, Y. C. Lin, and G. N. Lu “A Study on Local Compression for Injection Molding of Parts with Non-Uniform Thicknesses”, The 42nd IUPAC World Polymer Congress(MACRO2008), June 29 - July 4, 2008, Taipei,Taiwan.
  • C. L. Lee, T. C. Huang,, L. T. Jian, and S. Y. Yang, “Extrusion roller embossing process for rapid fabrication of microlens arrays on PC film”, The 42nd IUPAC World Polymer Congress(MACRO2008), June 29 - July 4, 2008, Taipei,Taiwan.
  • P.H. Huang, T.C. Huang, S.Y. Yang, Y.T. Sun, “Large-area fabrication of polymeric microlens array using UV gas-assisted nanoimprint process”, The 52nd International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIPBN 2008), 27-30 May 2008, Portland, Oregon, USA.
  • Sen-Yeu Yang, Tzu-Chien- Huang, Jian-Ren Ciou, and Po-Hsun Huang, “Diffusers with both surface-relief and particle-diffusing functions fabricated using hybrid extrusion roller embossing”, The 52nd International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIPBN 2008), 27-30 May 2008, Portland, Oregon, USA.
  • S.Y. Yang, T.C. Huang, J.K. Ciou, and B.D. Chan, “A CO2-assisted embossing method to fabricate polymeric microlens arrays,” 5th International Symposium on Nanomanufacturing, 23-25 Jan 2008, Singapore.
  • Sen-Yeu Yang*, Tzu-Chien Huang, Yen-Hao Chen, and Po-Hsun Huang, “Effects of processing parameters on the form accuracy of plastic aspheric lenses using a BeCu mold insert in injection molding process,” The Polymer Processing Society 24th Annual Meeting, 15-19 Jun. 2008, Salerno, Italy.
  • Sen-Yeu Yang*, Tzu-Chien Huang, Yen-Hao Chen, and Po-Hsun Huang, “Improving lifetime of BeCu injection mold inserts by depositing with Ni-P-PTFE layer on mold surface,” The Polymer Processing Society 24th Annual Meeting, 15-19 Jun. 2008, Salerno, Italy.
  • Sen-Yeu Yang*, Tzu-Chien Huang, Jian-Ren Ciou, Po-Hsun Huang, and Jing-Tang Wu, “A preliminary experiment of direct transcription of microstructure using extrusion roller-embossing,” International Conference on Advanced Manufacturing Technology 2007 (ICAM 2007), 26-30 Nov. 2007, Tainan, Taiwan.
  • L. T. Jiang, T. C. Huang, J. R. Ciou, and S. Y. Yang, "Direct Fabrication of Rigid Microstructures on Metal Rollers Using Dry Film Resist," Proceedings, 33rd International Conference on Micro- and Nano-Engineering (MNE 2007), 23-26 Sep. 2007, Copenhagen, Denmark.
  • F. S. Cheng, P. H. Huang, S. W. Xu, and S. Y. Yang, “Fabrication of Microlens Arrays Using Soft Roller Embossing with Gas-Pressurized Platform”, Proceedings, 33rd International Conference on Micro- and Nano-Engineering (MNE 2007), 23-26 Sep. 2007, Copenhagen, Denmark.
  • F. S. Cheng and S. Y. Yang, “A novel hydrostatic pressuring mechanism for soft UV-imprinting process”, ?Proceedings, 33rd International Conference on Micro- and Nano-Engineering (MNE 2007), 23-26 Sep. 2007, Copenhagen, Denmark
  • S. Y. Yang, F. S. Cheng, T. C. Huang, J. K. Ciou, and J. G. Loeser, “CO2-assisted embossing process for replication at lower-than-Tg”, The 51st International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIBPN 2007), 29 May.–1 Jun. 2007, Denver, Colorado, USA.
  • S. Y. Yang, C. Y. Chang, J. K. Ciou, J. H. Chang, B. D. Chan, L. A. Wang, and J. G. Loeser, “Fabrication of micro-lens arrays using CO2-assisted embossing”, The 51st International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIBPN 2007), 29 May – 1 Jun 2007, Denver, Colorado, USA.
  • Sen-Yeu Yang, Tzu-Chien Huang, Po-Hsun Huang, Tai-Yu Ko,” Study on flow imbalance during filling a multi-cavity mold using a H-type runners”, Asia Pacific Conference on Optics Manufacture 2007 (APCOM 2007), 11-13 Jan. 2007, Hong Kong, China.
  • Sen-Yeu Yang, Fang-Sung Cheng, Yung-Bin Chen, and Lon A. Wang, ” An Innovative Process Using Soft Mold and Gas-bag Pressuring Mechanism for Replicating Micro/Nano-features Onto Convex Curves Surfaces”, Great Lakes Photonics symposium 2006, 12-16 Jun. 2006, Dayton, Ohio, USA.
  • Shih-Chih Nian, Sen-Yeu Yang, ”The Experiment and Simulation of Spiral Cavities Filling Process with Impact Micro-injection Molding”, The Polymer Processing Society 22nd? Annual Meeting, 2-6 Jul 2006, Yamagata, Japan.
  • Shih-Chih Nian, Sen-Yeu Yang, ”The Filling Process of Molding Ultra-Thin Parts with Multi-Cavities ”, The Polymer Processing Society 22nd? Annual Meeting, 2-6 Jul 2006, Yamagata, Japan.
  • C.-Y. Chang, S.-Y. Yang, and J.-L. Shje, “A roller embossing process for rapid fabrication of microlens arrays on plate substrates”, Asian Workshop in Polymer Processing 2005, The First Taiwan/Japan International Polymer Processing Conference, 17-19 Oct 2005, Taoyuan, Taiwan.
  • S. C. Nian and S. Y. Yang, “The Performance of Impact Micro-injection Molding“, Asian Workshop in Polymer Processing 2005, The First Taiwan/Japan International Polymer Processing Conference, 17-19 Oct 2005, Taoyuan, Taiwan.
  • F. S. Cheng, S. Y. Yang, and Lon A. Wang, “Patterning on curved substrates using soft mold and gas-bag pressuring mechanism”, 31st International Conference on Micro- and Nano-Engineering (MNE 2005), 19-22 Sep 2005, Vienna, Austria.
  • F. S. Cheng, Y. C. Weng, S. Y. Yang, and Lon A. Wang, “Large area direct imprinting using soft mold and gas pressure”, The 49th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIBPN 2005), 31 May–3 Jun 2005, Grande Lakes, Florida, USA.
  • C. Y. Chang, S. R. Chen, and S. Y. Yang, “Precision Molding of V-grooved micro parts”, The Polymer Processing Society 20th Annual Meeting, Jun 2004, Akron, Ohio, USA.
  • F. S. Cheng, S. Y. Yang, Y. C. Weng and L. A. Wang, “12-in. wafer imprinting using soft mold and gas pressure mechanism “International Microprocesses and Nanotechnology Conference, 17th MNC, Osaka, Japan (2004).
  • J. H. Chang and S. Y. Yang, “Development of Rapid Heating and Uniformly Pressing System for Micro Hot Embossing”, Technical Papers of ANTEC, pp. 942-945, Chicago, IL (2004).
  • J. H. Chang, C. C. Chao, S. Y. Yang and L. A. Wang, “Large-area nano embossing using soft mold and gas pressure mechanism”, 48th EIPBN, San Diego, CA (2004).
  • C. Y. Chang, S. Y. Yang, and S. R. Chen, “ Precision Molding of V-grooved Micro Parts”, Proceeding of PPS-20, 20th International Meeting of Polymer proceeding Society, Akron, USA, June 2004.
  • S. C. Nian and S. Y. Yang, “Flow Visualization During Filling of Spiral Cavities Using an Impact-type Micro-Injection Molding Machine”, Proceeding of PPS-20, 20th International Meeting of Polymer proceeding Society, Akron, USA, June 2004.
  • C. W. Wu, L. S. Huang, J. H. Chang, S. Y. Yang and C. K. Lee, “A Novel Micro-Scale Recombining Technique Using Lateral Joining for A Large-Area Molding With Small Features”, IEEE MEMS, Kyoto, Japan (2003).
  • S. Y. Yang and J. H. Chang, “Experimental Study on the Hot Embossing of Large Thin Thermoplastic Films With Micro-Features”, Proceeding of 19th Annual Meeting of Polymer Processing Society, Melbourne, Australia (2003).
  • S. Y. Yang and J. H. Chang, “Gas Pressurized Hot Embossing - A Novel Method is Developed”, Proceeding of 19th Annual Meeting of Polymer Processing Society, Melbourne, Australia (2003).
  • S. Y. Yang, S. C. Nian and I. C. Sun, “Experimental Study on The Filling Characteristics During Micro-Injection Molding”, Proceeding of PPS-18, 18th International Meeting of Polymer proceeding Society, June 2002.
  • S. Y. Yang, S. C. Nian and I. C. Sun, “The Flow Visualization of Micro-Injection Molding”, Proceeding of PPS-2002, Polymer processing Society, Taipei, Taiwan, November 4-8, 2002.
  • S. Y. Yang and S. H. Parng, “Deformation Analysis for Injection Molding of Plastic Parts Coverd with Superplastic Zn-22%Al Sheet”, Proceeding of PPS-2002, Polymer processing Society, Taipei, Taiwan, November 4-8, 2002.
  • S. Y. Yang and J. D. Luo, “Ultrasonic Vibration Heated Hot Embossing of Plastic Plates with Micro-features”, Proceeding of PPS-2002, Polymer processing Society, Taipei, Taiwan, November 4-8, 2002.
  • Y. K. Shen, H. M. Jian, W. Y. Wu and S. Y. Yang, “Study on Numerical Simulation and Experiment of Lightguide Plate in Injection Molding”, Proceeding of PPS-2002, Polymer processing Society, Taipei, Taiwan, November 4-8, 2002.
  • S. C. Nian, S. Y. Yang, and C. H. Lin, “Study on the Performance of Rapid Mold Heating/Cooling System for Micro Injection Molding”, Proceeding of 19th Annual Meeting of Polymer Processing Society, Melbourne, Australia (2003).
  • S. Y. Yang, "The Precision Injection and Variable-Distance Injection Compression Molding of Wedge-Shape Plate", Proceedings of Europe/Africa Regional Meeting of Polymer Processing Society, Athens, Greece (2003).
  • 楊申語,吳宗祐,“射出壓縮成型在精密圓筒件與表面微肋件之應用探討”, 第二十四屆高分子研討會論文專輯, Jan., 2001.
  • 楊申語,林垂德,“加肋平板件氣體輔助射出成型之二次滲透探討”, 第二十四屆高分子研討會論文專輯, Jan., 2001.
  • 楊申語,陳復東,“射出成型用之快速模具實驗探討”, 第二十四屆高分子研討會論文專輯, Jan., 2001.
  • 楊申語,陳禎元,“導電複材射出成型參數對纖維分佈與電磁屏蔽效果影響之研究”, 第二十四屆高分子研討會論文專輯, Jan., 2001.
  • 楊申語,劉育辰,趙啟仲,“陶瓷粉末射出壓縮成型之研究”,第二十六屆高分子研討會論文專輯, Jan., 2003. [NSC 90-2216-E-002-023]
  • 楊申語,周鴻烈,張致遠,“氣輔射出圓管件尺寸脹縮及彎弧區殘留壁厚的探討”,第二十六屆高分子研討會論文專輯, Jan., 2003. [NSC 90-2216-E-002-020]
  • 張哲豪,楊申語,”流體快速熱壓印成型開發研究”,中國機械工程學會第二十屆全國學術研討會,國立台灣大學,民國92年12月。
  • 楊申語,黃榮山,陳仁浩,張致遠,羅志謙,張俊儀,黃勝田,簡維鋒,”創新型微光學增光分色片之設計與製造”,中國機械工程學會第二十屆全國學術研討會,國立台灣大學,民國92 年12 月。
  • 楊申語,粘世智,簡惠民,”不等行程射出壓縮製程於楔形板件之精密成型”,中國機械工程學會第二十屆全國學術研討會,國立台灣大學,民國92年12月。
  • 楊申語,黃榮山,陳仁浩,張致遠,粘世智,羅志謙,張俊儀,簡維鋒,湯競恆,羅維德,” 塑膠微透鏡陣列與微光柵繞射光學元件之設計與製作”,第二十七屆高分子研討會論文專輯, Jan., 2004. [NSC 91-2622-E-002-004]
  • 陳守仁,張致遠,楊申語,”塑膠V型溝槽元件之精密成型技術研究”,第二十七屆高分子研討會論文專輯, Jan., 2004. [NSC 91-2218-E-002-031]
  • 張致遠,楊申語,謝正倫,”滾輪微壓印製程開發與微光學元件之製作”,中國機械工程學會第二十二屆全國學術研討會,國立中央大學,民國94 年11月。
  • 張哲豪,趙啟仲,鄭芳松,翁永春,王倫,楊申語,”軟模氣體熱壓應用於大面積微奈米壓印製程研究”,中國機械工程學會第二十二屆全國學術研討會,國立中央大學,民國94 年11 月。
  • 張致遠,楊申語,黃榮山,鄭天民,”創新氣體輔助熱壓成型技術製作微透鏡陣列元件”,第九屆奈米工程暨微系統技術研討會,南台科技大學,民國94年11 月。
  • 楊申語,黃子健,邱俊凱,” CO2輔助氣體壓印製程研究”,第三十屆高分子研討會論文專輯, 1月, 2007.
  • 楊申語,黃子健,黃柏勳,柯岱佑,”成型參數對一模多穴流動不平衡之影響”,第三十屆高分子研討會論文專輯, 1月, 2007.

C. 專書及專書論文

1. S. Y. Yang, “Analysis of Post-Filling Process during Injection Molding” Ph.D. Dissertation, University of Minnesota, MN, USA.


D. 技術報告及其他等

  1. 楊申語,”楔形板件精密射出與射出壓縮成型研究(II) ”,國科會研究成果報告,2004年7月。
  2. 楊申語,”光學精密元件射出成型之整合研究-總計畫(II) ”,國科會研究成果報告,2004年7月。
  3. 楊申語,” 創新型微光學增光分色片應用於CMOS影像感測器之研究(II) ”,國科會研究成果報告,2004年7 月。
  4. 楊申語,”塑膠繞射光學元件之精密成型技術整合研究(I)-子計畫” 國科會研究成果報告,2005年7月。
  5. 楊申語,”塑膠繞射光學元件之精密成型技術整合研究(I)-總計畫”,國科會研究成果報告,2005年7月。
  6. 楊申語,”奈米壓印系統設備開發及製程研究(I)-總計畫” 國科會研究成果報告,2005年7月。
  7. 楊申語,”奈米壓印系統設備開發及製程研究(I)-子計畫” 國科會研究成果報告,2005年7月。
  8. 楊申語,”塑膠繞射光學元件之精密成型技術整合研究(I I)-總計畫”,國科會研究成果報告,2006年7月。
  9. 楊申語,”奈米壓印系統設備開發及製程研究(II)-總計畫”,國科會研究成果報告,2006年7月
  10. 楊申語,”奈米壓印系統設備開發及製程研究(II)-子計畫”,國科會研究成果報告,2006年7月
  11. 楊申語,”塑膠繞射光學元件之精密成型技術整合研究(II)-子計畫”,國科會研究成果報告,2006年7月
  12. 鄭芳松,陳永彬,王倫,楊申語,”奈米壓印製造技術發展簡介”台灣奈米會刊,NO7. 12月 2006年
  13. 楊申語,”微透鏡陣列滾輪式轉印製程之開發”,國科會研究成果報告,2007年7月。
  14. 楊申語,”精密塑膠光學元件模具與複製成型技術整合研究(I)-總計畫”,國科會研究成果報告,2007年7月。
  15. 楊申語,”精密塑膠光學元件模具與複製成型技術整合研究(I)-子計畫”,國科會研究成果報告,2007年7月。
  16. 楊申語、黃子健、邱建仁,”惠和專利驗證”,慶齡工業研究中心技術服務案報告,國科會研究成果報告,2007年6月。
  17. 楊申語、黃子健、黃柏勳,”微奈米結構光學應用技術研究”,工研院委託學術機構研究成果報告,2007年11月。

 

 

E. 專利

  1. 吳恩柏、呂文述、楊申語、蔡坤男,減翹半導體封膠外型及其製造裝置,新型專利,中華民國專利証號:155057,專利期限:1999/08/21~2010/05/07。
  2. 黃榮堂、楊申語,覆晶凸塊形狀及排列的設計方法,發明專利,中華民國專利証號:145183,專利期限:2001/10/21~2020/03/20。
  3. 黃榮堂、楊申語、江志豪,微感測器共通型封裝的方法,發明專利,中華民國專利証號:169456,專利期限:2002/12/01~2021/11/05。
  4. 張哲豪、楊申語,氣體微熱壓成型方法,新型專利,中華民國專利証號:193140,專利期限:2003/12/21~2022/08/15。
  5. 粘世智、楊申語,微型射出成型機之融膠射出機構,新型專利,中華民國專利証號:224823,專利期限:2004/05/21~2013/04/26。
  6. 謝國煌、楊申語、黃榮山、張致遠,微透鏡陣列之製造方法,發明專利,中華民國專利証號:I289683,專利期限:2007/11/11~2025/09/26。
  7. 謝國煌、楊申語、黃榮山、劉士榮、張致遠,用於光電製程之微轉印印章的製造方法,發明專利,中華民國專利証號:I276540,專利期限:2007/03/21~2025/11/29。
  8. 謝國煌、黃榮山、楊申語、王大銘、張培仁、張致遠、陳偉源,用於光電製程之微轉印方法,發明專利,中華民國專利証號:I252181,專利期限:2006/04/01~2023/08/28。
  9. 張哲豪、楊申語,快速加熱冷卻暨均勻施壓的微熱壓印成型方法,發明專利,中華民國專利証號:I222925,專利期限:2004/11/01~2023/06/10。
  10. 謝國煌、楊申語、黃榮山、劉士榮、張致遠,用於光電製程之微轉印印章與沾色裝置,發明專利,中華民國專利公開號:200720106。
  11. 楊申語、張致遠、朱明輝,具微結構之滾輪構造、模具及其製作方法,中華民國專利申請中。
  12. 楊申語、謝國煌、邱建仁、江亮霆、黃柏勳,彩色濾光片之生產裝置,中華民國專利申請中。
  13. 楊申語、黃子健、邱俊凱、詹秉達,改良式壓印裝置,中華民國專利申請中。
  14. 楊申語,許淑雯、吳景棠、詹秉達、黃子建,改良式滾輪壓印裝置,中華民國專利申請中。
  15. 翁永進、楊申語、翁永春、翁錦龍,”奈米級探針陣列製造方法”,中華民國公開編號200902433
  16. 翁永春、翁永進、楊申語、翁錦龍,”微結構的充填成形系統及其方法”,中華民國公開編號200940793
  17. 翁永進、楊申語、翁永春、翁錦龍,”奈米粉流體壓印系統及其方法”,中華民國公開編號200839429
  18. 翁永進、翁永春、楊申語、翁錦龍,”控制曝光的裝置及方法”,中華民國公開編號200919097
  19. 翁永進、翁永春、楊申語、翁錦龍,”具精密定位裝置之精密製程/量測系統”,中華民國公開編號200915035
  20. 翁永進、翁永春、楊申語、翁錦龍,”具黏貼式之微結構阻劑薄膜製造方法”,中華民國公開編號200841122
  21. 翁永進、翁永春、楊申語、翁錦龍,”微結構的充填成型系統及其方法”,中華民國公開編號200840793
  22. 翁永進、楊申語,”奈米壓痕測量系統的改良裝置”,中華民國公開編號200914823
  23. 楊申語、楊銘乾、李文福、翁永進、翁永春、翁錦龍,”微結構製造方法”,中華民國公開編號200914362
  24. 翁永進、翁永春、楊申語、翁錦龍,”具奈米孔洞之模板的製造方法”,中華民國公開編號200919099

 

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