|
摘要
隨著各種技術的發展越來越成熟，更小型的半導體元件正迅速發展，尺寸大多在150μm以下，遠小於傳統型元件。因此在製造和測試上，正面臨嚴峻的挑戰。以點測為例，機台檢測傳統元件產生的振動幅度在檢測小型半導體元件會導致測量上的問題。
目前業界大多依靠個人的經驗和判斷來處理點測機的振動問題，因此結果是不可預測的。相反地，本研究將應用機器結構建模並進行模態分析，而後添加控制系統來接近實際的運動響應，最後利用該模型找到機器結構的主要模態以及預測隨參數變化的振動響應，作為工程上改善的基礎。從研究結果表明，本研究的方法是可行的，模型預測的響應與實際測量值的趨勢一致。
關鍵字：模態分析、有限元素法
Abstract
As the various technologies evolve and are getting more
mature, smaller semiconductor components are rapidly developed. Normally
most of the feature size is below 150μm, much smaller than traditional components.
The requirements for manufacturing and testing are facing critical
challenge. Taking spot testing as an example, vibration detection of small
semiconductor components with the same traditional components may cause
measurement issues.
The industry generally relies on experiences and personal
judgement to deal with the vibration problems of the spot measuring
machine, and the results are not predictable. This research, instead,
applied the machine structure modeling and conducted modal analysis. A
control system was then added to approach the actual motion responses.
Finally the model was used to find the main modes of the machine structure
and predict the vibration responses with parameter changes, used as the
basis for engineering improvement. It is found that the approach is
successful, and responses predicted by the model are in line with the trend
of the actual measured values.
Keywords:
Modal Analysis、Finite Element
Method(FEM).
|
